Workshop on IC Advances in China (ICAC) 2023

March 22-24, 2023

Shenzhen, China

Welcome to Workshop on IC Advances in China (ICAC) 2023

华人芯片设计技术研讨会 2023

The goal of the ICAC Workshop is to build a platform for the academia and industry people in China to have more open technical discussions, and to generate possible collaborations, and to brainstorm new ideas and directions. Therefore, we are gathering the top Chinese IC design scholars/engineers who published ISSCC and/or JSSC in the past two years, and try to attract more attendees from the IC industry.

We hope the workshop speakers and audiences produce chemical reactions, as well as electrical resonances as our logo shows. To this end, language should not be a problem. This workshop uses both Chinese and English. This workshop does not publish papers, and the oral speakers are by invitation only.

ICAC 2023 Slides Download
(FOR STUDY ONLY, DO NOT DISTRIBUTE!)
The below two download links are available:
Download Option #1：https://www.icacworkshop.cn/2023/ICAC2023PresentationSlides.rar
Download Option #2：https://pan.baidu.com/s/1JXg6wwxmpF8e8qd9-5Gh8Q?pwd=hrht

SPEAKERS

In Alphabetical Order...

Guigang Cai, University of Macau

Hao Cai, Southeast University

Chixiao Chen, Fudan University

Hong Chen, Tsinghua University

Jixin Chen, Southeast University

Wenhua Chen, Tsinghua University

Yong Chen, University of Macau

Chi Hang Chan, University of Macau

Lin Cheng, University of Science and Technology of China

Weiwei Shan, Southeast University

Wei Deng, Tsinghua University

Zhixian Deng, University of Electronic Science and Technology of China

Menghan Guo, OmniVision (Shanghai)

Xiaofeng Guo, NewRadio Technologies Co., Ltd.

Yanshu Guo, Tsinghua University

Weifeng He, Shanghai Jiao Tong University

Mo Huang, University of Macau

Haikun Jia, Tsinghua University

Hongyang Jia, Tsinghua University

Yang Jiang, University of Macau

Jing Jin, Shanghai Jiao Tong University

Kai Kang, University of Electronic Science and Technology of China

Ka-Meng Lei, University of Macau

Chi-Seng Lam, University of Macau

Zhiting Lin, Anhui University

Liyuan Liu, Institute of Semiconductors, Chinese Academy of Sciences

Yongpan Liu, Tsinghua University

Yan Lu, University of Macau

Kaisheng Ma, Tsinghua University

Rui P. Martins, University of Macau (Keynote)

Yufei Ma, Peking University

Pui-In (Elvis) Mak, University of Macau

Xiangyu Mao, University of Macau

Jingzhou Pang, Chongqing University

Nan Qi, Institute of Semiconductors, Chinese Academy of Sciences

Huizhen Qian, University of Electronic Science and Technology of China

Wanyuan Qu, Zhejiang University

Ka Fai UN, University of Macau

Linxiao Shen, Peking University

Yiyang Shu, University of Electronic Science and Technology of China

Xin Si, Southeast University

Nan Sun, Tsinghua University

Zhichao Tan, Zhejiang University

Xiyuan Tang, Peking University

Zhong Tang, Vango Technologies, Inc.

Fengbin Tu, The Hong Kong University of Science and Technology

Cheng Wang, University of Electronic Science and Technology of China

Yuanfei Wang, University of Macau

Zixuan Wang, Nanjing University of Posts and Telecommunications

Yinshui Xia, Ningbo University

Na Yan, Fudan University

Bingzheng Yang, University of Electronic Science and Technology of China

Jianguo Yang, Institute of Microelectronics of the Chinese Academy of Sciences

Jun Yin, University of Macau

Yun Yin, Fudan University

Shouyi Yin, Tsinghua University

Jinshan Yue, Institute of Microelectronics of the Chinese Academy of Sciences

Chenchang Zhan, Southern University of Science and Technology

Milin Zhang, Tsinghua University

Minglei Zhang, University of Macau

Linxiao Shen, Peking University

Zhao Zhang, Institute of Semiconductors, Chinese Academy of Sciences

Xiuyin Zhang, South China University of Technology

Bo Zhao, Zhejiang University

Dixian Zhao, Southeast University

Tim Kwang-Ting CHENG, The Hong Kong University of Science and Technology (Keynote)

Jun Zhou, University of Electronic Science and Technology of China

Peigen Zhou, Southeast University

To be updated...

Conference Committee


Conference Co-Chairs

Dixian Zhao, Southeast University     
赵涤燹，东南大学

Jiawei Xu, Fudan University     
徐佳伟，复旦大学

Yan Lu, University of Macau     
路延，澳门大学

Technical Program Co-Chairs

Qiang Li, University of Electronic Science and Technology of China      
李强，电子科技大学

Nan Sun, Tsinghua University     
孙楠，清华大学

Pui-In Mak, University of Macau      
麦沛然，澳门大学

Yongpan Liu, Tsinghua University     
刘勇攀，清华大学

Chixiao Chen, Fudan University     
陈迟晓，复旦大学

Conference Program

ICAC 2023 Conference Program Day0-March 22
10:00-20:00 签到及会议资料领取(Conference Registration and Materials Collection)
18:30-21:00 赞助商宣讲 （Sponsors Speech)
学生海报展示 （Student Poster Presentation)
ICAC 2023 Conference Program Day1-March 23
08:30 大会欢迎辞: 赵涤燹，东南大学
08:40 马许愿，澳门大学
09:20 郑光廷，香港科技大学
茶歇
　 射频与毫米波技术（殷俊，澳门大学） 新型感知与计算芯片（周军，电子科技大学） 模数转换器 I（陈知行，澳门大学）
10:30 麦沛然，澳门大学 郭衍束，清华大学 孙楠，清华大学
Ultra-Low-Power Passive-Intensive BLE Receiver A Polar-Modulation Based Cryogenic Qubit State Controller for Quantum Computing A 1GS/s PVT-Robust Ring-Amp-Based Pipelined TI-SAR ADC
11:00 王成，电子科技大学 马恺声，清华大学 张明磊，澳门大学
A Calibration-Free 12.8-16.5GHz Cryogenic CMOS VCO with 202dBc/Hz FoM for Classic-Quantum Interface A 28nm 68MOPS 0.18μJ/Op Paillier Homomorphic Encryption Processor with Bit-Serial Sparse Ciphertext Computing High-Performance Time-Domain ADC
11:30 赵涤燹，东南大学 郭梦晗，豪威科技（上海） 郭啸峰，纽瑞芯
CMOS Millimeter-Wave Phased-Array IC Design with High Linearity and Low Noise A Three-wafer-stacked, Hybrid 15MP CIS + 1 MP EVS with 4.6 GEPS Readout, In-pixel TDC and On-chip ISP and ESP Function A 13b 600-675MS/s Tri-State Pipelined-SAR ADC with  Inverter-Based Open-Loop Residue Amplifier
午休
　 新型射频技术 （邓伟，清华大学） 存算一体处理器（单伟伟，东南大学） 电源架构与控制（刘寻，香港中文大学（深圳））
13:30 赵博，浙江大学 尹首一，清华大学 詹陈长，南方科技大学
Wireless Sensing Chips: From 'Low-Power' to 'Battery-Free' CV-CIM: A 28-nm XOR-Derived Similarity-Aware Computation-in-Memory for Cost-Volume Construction A 6.78-MHz Wireless Power Transfer System with Inherent Wireless Phase-Shift Control without Feedback Data Sensing Coil
14:00 张沕琳，清华大学 周军，电子科技大学 黄沫，澳门大学
TBD DL-VOPU: An Energy-Efficient Domain-Specific Deep Learning based Visual Object Processing Unit supporting Multi-Scale Semantic Feature Extraction for Mobile Object Detection/Tracking Applications A 12-1 Quad-Output Switched-Capacitor Buck Converter with Shared DC Capacitors Achieving 90.4% Peak Efficiency and 48mA/mm3 Power Density at 85% Efficiency
14:30 殷韵，复旦大学 贾弘洋，清华大学 蔡桂港，澳门大学 
A Fully-Integrated Wideband Digital Polar Transmitter with 11-bit Digital-to-Phase Converter in 40nm CMOS Full-stack Integration of Efficient In-memory Computing with Robust Approximation A Compact 12V-to-1V Hybrid Buck Converter
15:00 钱慧珍，电子科技大学 涂锋斌，香港科技大学 毛翔宇，澳门大学
Millimeter-wave Power-DAC with LO Leakage Suppression and Data-rate Enhancement TensorCIM: Digital Computing-In-Memory Tensor Processor for Multi-Chip-Module-based Beyond-NN Acceleration High-Current Fully-Integrated Voltage Regulators for Multi-Core Processors
茶歇
　 射频振荡器（赵博，浙江大学） 存内计算电路（贾弘洋，清华大学） 模数转换器 II（揭路，清华大学）
15:45 殷俊，澳门大学 杨建国，中国科学院微电子研究所 陈知行，澳门大学      
A mm-Wave Low-Phase-Noise Dual-Path-Synchronized Quad-Core Oscillator A 9-Mb HZO-based Embedded FeRAM Macro with a 1012-Cycle Endurance and, 5/7ns Read/Write using 5ns Read, 7ns Write, ECC-Assisted Data Refresh and an Offset-Canceled Sense Amplifier Involution of Analog-to-Digital Converter Community
16:15 贾海昆，清华大学 蔺智挺，安徽大学 唐希源，北京大学
The 8-shape inductors: A Nice-to-Have Piece in Your RFIC design Toolbox In Situ Storing 8T SRAM-CIM Macro for Full-Array Boolean Logic Operations A 150kHz-BW 15-ENOB Incremental Zoom ADC with Skipped Sampling and Single Buffer Embedded Noise-Shaping SAR Quantizer
16:45 张钊，中国科学院半导体研究所 岳金山，中国科学院微电子研究所 谭志超，浙江大学
Design of the Multi-Path Loop Based PLL for Low-Voltage Low-Power Application A 28nm 16.9-300TOPS/W Computing-in-Memory Processor Supporting Floating-Point NN Inference/Training with Intensive-CIM Sparse-Digital Architecture Low-Power Delta-Sigma ADC Design
17:15 张奕涵，北京大学 蔡浩，东南大学    金晶，上海交通大学
A 0.954nW 32kHz Crystal Oscillator in 22nm CMOS with Gm-C-Based Current Injection Control A 28-nm 2-Mb STT-MRAM Computing-in-Memory Macro with a Refined Bit-Cell and 22.4 – 41.5TOPS/W for AI Inference High Resolution Noise Shaping SAR ADC With An Integrated Highly Linear Input Buffer
17:45 舒一洋，电子科技大学 马宇飞，北京大学 沈林晓，北京大学
Scalable Inter-Core-Shaping Multi-Core Oscillator for High-FoM Low-Phase-Noise mm-Wave Signal Generation A Delta-Sigma Computing-In-Memory (ΔΣCIM) SRAM Macro for Edge AI Processing A 7.9fJ/Conversion-Step and 37.12aFrms Pipelined-SAR Capacitance-to-Digital Converter with kT/C Noise Cancellation and Incomplete-Settling-Based Correlated Level Shifting
　 　 　 　
19:30-21:30 芯片产业主题论坛
主持人：赵涤燹 东南大学
ICAC 2023 Conference Program Day2-March 24
　 毫米波与太赫兹技术 I（康凯，电子科技大学） 领域智能芯片（陈迟晓，复旦大学）
08:30 邓伟，清华大学 阮家煇，澳门大学
Ka-band 4TX/4RX Dual-stream Phased-array Joint Radar-Communication CMOS Transceiver A Low-Power Mixed-Signal Voice Activity Detector (VAD) Featuring a Non-Volatile Capacitor-ROM, a Short-Time CNN Feature Extractor and an RNN Classifier
09:00 陈文华，清华大学 陈虹，清华大学
Broadband Energy-Efficient Silicon-Based Terahertz Generation Based on Frequency Multiplier Chains ANP-I: A 28nm 1.5pJ/SOP Asynchronous Spiking Neural Network Processor Enabling Sub-0.1μJ/Sample On-Chip Learning for Edge-AI Applications
09:30 陈继新，东南大学 何卫锋，上海交通大学
W-band Scalable 2 × 2 Phased-Array Transmitter and Receiver Chipsets in SiGe BiCMOS for High Data-Rate Communication High Energy-Efficient Mixed-Signal GPS Accelerator with Charge-Based Correlation Computing for Signal Acquisition
10:00 刘力源，中国科学院半导体研究所 刘勇攀，清华大学
CMOS Terahertz Image Sensors Energy-Efficient Machine Learning Processor: A General Domain Approach
茶歇
　 开关电容与能量采集（姜俊敏，南方科技大学） 高能效智能芯片（岳金山，中国科学院微电子研究所）
10:45 江洋，澳门大学 单伟伟，东南大学
A Rational Switched-Capacitor DC-DC Converter with Soft Conversion Ratio Transitions An Efficient and Reliable Negative Margin Timing Error Detection for Neural Network Accelerator without Accuracy Loss in 28nm CMOS
11:15 夏银水，宁波大学 陈迟晓，复旦大学
Configurable Hybrid Energy Synchronous Extraction Interface With Serial Stack Resonance for Multi-Source Energy Harvesting A CIM Transformer Acceleerator with in-Memory Butterfly Zero Skipper for Unstructured-Pruned NNs
11:45 王远飞，澳门大学 司鑫，东南大学
A Continuously Scalable-Conversion-Ratio SC Converter with Reconfigurable VCF Step for High Efficiency over an Extended VCR Range A 28nm Horizontal-weight-shift and Vertical-feature-shift based Separate-wordline 6T SRAM Computation-in-Memory Unit-Macro for Edge Depthwise based Neural Networks
午休
　 频率源与功放技术 （陈勇，澳门大学） 模拟电路技术 (徐佳伟，复旦大学)
13:30 康凯，电子科技大学 李家明，澳门大学
　 Analysis and Design of High-harmonic-rejection Multi-ratio mm-wave Frequency Multipliers A 12/13.56MHz Crystal Oscillator with Binary-Search-Assisted Two-Step Injection Achieving 5.0nJ Startup Energy and 45.8µs Startup Time
14:00 章秀银，华南理工大学 祁楠，中国科学院半导体研究所
　 Broadband and Multi-function Millimeter-wave Power Amplifier in 28 nm Bulk CMOS High-speed Circuits Design in Optical Transceivers for Datacenter Co-packaged Optics
14:30 闫娜，复旦大学 唐中，杭州万高
　 Analysis and Design of a Dual-Mode VCO with Inherent Mode Compensation Enabling a 7.9-14.3GHz 85fs-rms Jitter PLL A Sub-1V Energy-Efficient Capacitively-Biased BJT-Based Temperature Sensor with an Inaccuracy of ±0.15°C (3σ) from -55 °C to 125 °C
15:00 庞竞舟，重庆大学 王子轩，南京邮电大学
　 Broadband GaN MMIC Doherty Power Amplifier Using Continuous-Mode Combining for 5G Sub-6 GHz Applications A 16MHz XO with 17.5μs Startup Time Under 10000ppm-ΔF Injection Using Automatic Phase-Error Correction Technique
茶歇
　 毫米波与太赫兹技术 II（庞竞舟，重庆大学） 混合架构电源转换器（高源，南方科技大学）
15:45 陈勇，澳门大学 程林，中国科学技术大学
　 Silicon-Based Harmonic-Extraction Sub-THz VCO Incorporating Multi-Resonance, Multi-Core, and Multi-Mode (3M) Techniques A High-Efficiency Hybrid Buck-Boost Converter with Always Reduced Conduction Loss
16:15 杨秉正，电子科技大学 屈万园，浙江大学
　 71-to-89GHz Double-Edge-Triggered Quadrature RFDAC with Data-Rate Improvement and LO Leakage Suppression High Efficiency Dual-Path Series-Capacitor 12/1V Converter with Low V·A Metric
16:45 周培根，东南大学 林智声，澳门大学
　 A 211-to-263-GHz Dual-LC-Tank-Based Broadband Power Amplifier With 14.7-dBm PSAT and 16.4-dB Peak Gain in 130-nm SiGe BiCMOS A Dual-Inductor Quad-Path Hybrid DC-DC Converter
17:15 邓至贤，电子科技大学 路延，澳门大学
　 Boardband Phased-Array Transmitter and Receiver A Reconfigurable Bidirectional Power Delivery Voltage-Regulating USB Cable

Student Poster Session

In order to further encourage exchanges among students in the field of chip design, ICAC 2023 will set up a student poster session in addition to the invited talks. Students who are interested are welcome to attend and display. The best student poster award will be selected and presented at the conference. Students who participate in the poster session will receive an excellent participation experience.

The Link to submit your posters: https://iconf.young.ac.cn/6qFq9 (Closed)

Important Dates:
Student Poster Submission Deadline：
10th February, 2023
Camera Ready Submission Deadline:
10th March, 2023
Student Poster Session Date:
22nd March, 2023
Download the CFP Flyer

Poster List

March 22, 2023 | 18:30-21:00

Registration


Early-bird Registration Fee

(On or before Feb. 20 Mar. 01, 2023)
  • Student: 1000 RMB
  • Regular: 2200 RMB

Regular Registration Fee

(After Feb. 21 Mar. 02, 2023)
  • Student: 1200 RMB
  • Regular: 2600 RMB

Go →

Notes:

  • Please click the above button or the following link to make registration: https://iconf.young.ac.cn/JYyFm
  • You will receive a confirmation email upon successful registration. Please click to download the conference notification in PDF, and contact us if you need an invitation letter: icacworkshop@126.com.
  • One registration fee can be waived for every four registrations who register at the same time and from the same affiliation. Click the registration link for more information. (Important Notes: Discount is only valid before March 22, 2023.)

    • Organizers & Sponsors


    Organized by

                               

    Supported by

    Shenzhen Futian Government

    The Construction and Development Affairs Office of Hetao Shenzhen-hongkong Science and Technology Innovation Cooperation Zone


    Hosted by

    Hua-Xin Technology Center


    Diamond Sponsors:

    Image

    华为海思半导体

    Image

    中兴微电子

    Image

    博通集成

    Platinum Sponsors:

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    矽力杰

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    兆易创新

    Image

    思瑞浦微电子

    Image

    纽瑞芯

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    晶华微

    Gold Sponsors:

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    上海北芯

    Contact Us

    For query, please contact conference secretary:

    Ms. Joyce Zhong

    Email: icacworkshop@126.com

    Tel/Phone: (86)18628263876